Technical Data
Product Name
Component
Applications
Features
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8540HSP-Cu
8502-Cu
8540-A
9000-SUP
9000E-LEV
RDL，Normal pillar, Micro pillar，Mega pillar， Conformal TSV
Versatile applications, high plating speed, high purity of deposition, adjustable morphology, good uniformity, long bath life.
9200-Cu
9200-Electrolyte
TSV9200-A
TSV9200-S
TSV9200-L
TSV
Bottom-Up filling, high aspect ratio, low overburden, high filling speed, void free, high bath stability and long bath life.
9600-Cu
9601-Electrolyte
9600-A
9600-S
9600-L
Mega pillar
High plating speed, flat pillar profile, excellent within die and within wafer uniformity, wide operating window and PR compatibility, long bath life.
Nickel BP
Ni Sulphamate
Ni Chloride-CONC
Boric Acid
BP-Wetting Agent
UBM，Barrier
matte to semi-bright dposit, ductile and low prosity deposits, excellent solderability, ease of solution maintenance.
TS4000S
TS4000S-Tin
TS4000S-Ag
TS4000S-MSA
TS4000S-Complex
TS4000S-Pri
TS4000S-Sec
Micro bump，C4 bump， Cu pillar capping
Versatile applications, high plating speed, excellent co-planarity, smooth surface morphology, good PR compatibility, long bath life, void free.